Printed Circuit Boards
- Prototype Manufacturing
- PCB Board: FR4
- Aluminum Base PCB
- Ceramic PCB
- Rigid Flex PCB
- High Tg PCB
- Special PCB
- Heavy Copper PCB
- Flex PCB
- HDI PCB
Manufacturing Capabilities
| Layers | single-side to above 40 layers | |
| Min track width | 3.5mil (0.089mm) | |
| Min track space | 3mil (0.076mm) | |
| Min space between track to pad, pad to pad | 3mil (0.076mm) | |
| Minimum drill hole diameter , plated | 6mil (0.15mm) mechanical drill; 4mil for laser drill (0.10mm) | |
| Maximum drill | 6.5mm mechanical drill | |
| Min pads for vias | 12mil (0.3mm) | |
| Max aspect ratio | 0.052083333 | |
| Max PCB dimension | 23 x 35 inches (584.2 x 889.0mm) | |
| Max PCB dimension for 1 layer (OSP finish) | 17.72 x 47.24 inches (450 x 1200mm) | |
| PCB thickness | 8.27-275.8mil (0.21-7.0mm) | |
| Max copper weight | 6 OZ (210 Um) | |
| Soldermask bridge between pads | 6mil (0.15mm) | |
| Minimum soldermask annular | 1.5mil (0.038mm) | |
| Soldermask colors | green, red, black, blue, white, and peelable | |
| Plugged hole size | 0.15mm- 0.5mm | |
| Surface treatment |
HASL , HASL Pb free, Electroless Nickel Immersion Gold (ENIG)Gold, Gold fingers (Hard gold), Carbon printing.
|
|
| Special materials |
HTG FR4, high frequency (Rogers, Teflon, VT-47, ARLON, TYCONIC), halogen free, different laminating materials mixed.
|
|
| Special techniques |
blind and buried vias (min hole size is 0.1 mm), many layers with heavy copper.
|
|
| Important Note |
The copper foil is 35 Um and 17um, If the copper foil is 70 um and above, the parameters will change.
|