Manufacturing Specifications.
Viasystems SA supports the customer’s full product life cycle from offering prototype PCBs for new product introduction to high-volume, low-cost fabrication of complex boards .
We will always assist promptly to customers’ needs.
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Specifications
| Process Capability | |||||
| Seq | Process | Item | Unit | Process Capability | |
| 1 |
Basic Information
|
Surface
|
Surface Treatment | Tin lead/ Leadfree HASL, Flash Gold, ENIG, OSP, Immersion Tin/ Silver, Hard Gold | |
| 2 | Selective Surface Treatment | ENIG +OSP, ENG+ Gold Finger, Flash Gold+HASL. Flash Gold+ Flash Finger, Immersion Silver+ Gold Finger, Immersion Tin+Gold Finger | |||
| 3 |
Products Capability
|
Layer Count | Layer | 1-40(≥30 Layer Needs Review) | |
| 4 | Bow and Twist | % | 0.7 (≤ 0.5 Needs Process Review) | ||
| 5 | Min Finished size | mm | 10*10 | ||
| 6 | Max Finished Size (4L) | inch | 22.5*33.5 (Needs Review if length exceeds 30 Inch) | ||
| 7 | Max Finished Size (≥6L) | inch | 22.5*26.5 (Needs Review if length exceeds 22.5 Inch) | ||
| 8 | Multi-press For Blind/Buried Vias | / | Multi-press Cycle ≤ 3 Times (Needs revew for 2 cycles pressing) | ||
| 9 | Max Finished Size (Double Sides) | inch | 23*35 (Needs Review if length exceeds 30 Inch) | ||
| 10 | Finished Board Thickness | mm | 0.20-7.0 (≤ 0.2mm Needs Review), ≤ 0.4mm for HASL | ||
| 11 | Finished Board Thickness Tolerance (≤1.0mm) | mm | ± 0.1 | ||
| 12 | Finished Board Thickness Tolerance (>1.0mm) | mm | Material Thickness ± 10% | ||
| 13 | Unspecified Finished Board Thicknss Tolerance (No stack up requirements) | mm | Multilayer: ≤ 2.0 mm can ± 0.1; 2.0-3.0 mm Can ± 0.15; ≥ 3.0mm can ±0.2; Double sides +/- 10% | ||
| 14 |
Reliable Test
|
Peel Strength | N/cm | 7.8 | |
| 15 | Flammability | 94V-0 | |||
| 16 | Ionic Contamination | ug/cm2 | ≤ 1 | ||
| 17 | Min Dielectic Thickness | mm | 0.075 (Only for HOZ Base Copper)/ 1OZ if copper ground area >80% | ||
| 18 | Impedance Tolerance | % | ±5Ω(<50Ω), ±10%(≥50Ω); ≥50Ω ± 5% <Needs Review> | ||
| 19 |
Basic Material Type
|
Material Type
|
High Tg Material | Shengyi Tg >170C (S1170) | |
| 20 | Impedance Control Material | Others need Review | FR-4, FR-4 High Tg Series | ||
| 21 | RCC Material | Needs Review | Cooper foil thickness 12um, Dielectic Thickness 65, 80, 100um (After Pressing 55, 70, 90um) | ||
| 22 | Prepeg Type | FR-4 Prepreg, LD-1080 (HDI) | 7628 2116 1080 3313 106 | ||
| 23 | Copper Foil | Copper Foil | um | 12, 18, 35, 70, 105 (Use 70UM base Copper, After Plating 105UM) | |
| 24 |
Innerlayer & Outerlayer Image Transfer
|
Machine | Scrubbing Machine | 0.11-3.2mm, min 9*9inch | |
| 25 |
Innerlayer Process Capability
|
Laminator, Exposer | 0.11-6.0mm, min8*8inch, max 24*24 inch | ||
| 26 | Etching Line | 0.11-6.0mm, min 7*7 inch | |||
| 27 | Min Inner Line Width (18um copper foil, before Compensation) | mil | 2.5-3 | ||
| 28 | Min Inner Line Spacing (18um copper foil, After Compensation) | mil | 2.5 | ||
| 29 | Min Inner Line Width (35um copper foil, before Compensation) | mil | 3.5 | ||
| 30 | Min Inner Line Spacing (35um copper foil, After Compensation) | mil | 2.8 | ||
| 31 | Min Inner Line Width (70um copper foil, before Compensation) | mil | 5 | ||
| 32 | Min Inner Line Spacing (70um copper foil, After Compensation) | mil | 3 | ||
| 33 | Min Inner Line Width (105um copper foil, before Compensation) | mil | 6 | ||
| 34 | Min Inner Line Spacing (105um copper foil, After Compensation) | mil | 3.5 | ||
| 35 | Min Inner Line Width (140um copper foil, before Compensation) | mil | 7 | ||
| 36 | Min Inner Line Spacing (140um copper foil, After Compensation) | mil | 8 (7 mils needs review) | ||
| 37 | Min Spacing from hole edge to conductive | mil | ≤ 6L 8mil (Partial 7mil), ≤18L 10 mil (Partial mil), ≤ 20L 12 mil (Partial 11mil) | ||
| 38 | Min Innerlayer Annular Ring | mil | 4 (18,35um, Partial 3.5), 6(70um), 8 (105um) | ||
| 39 | Min Innerlayer Isolation Clearance | mil | Conductive to conductive 10 mil (Partial 8 mil) | ||
| 40 | Min Spacing From board to Conductive | mil | 8 (Except blind vias) , 10 (Blind Vias) | ||
| 41 | Min Gap with between copper ground | 5 (35um base copper) ≥ 2pcs (≥ 70um needs review) | |||
| 42 | Different Copper thinckness for inner core | 18/35, 35/70 (needs review) | |||
| 43 | Max Finished Copper Thickness | 5oz (175um), ≥ 3oz needs review | |||
| 44 |
Outer Layer Process Capabilty
|
Min Outer Line width (6-12um base copper, before compensation) | mil | 2.5-3.0 (Achieve copper Thickness 3um-35um) | |
| 45 | Min Outer Line spacing (6-12/18um base copper, after compensation) | mil | 2.5 | ||
| 46 | Min Outer Line width (18um base copper, before compensation) | mil | 4 (Achieve copper Thickness 35um-40um) | ||
| 47 | Min Outer Line spacing (18um base copper, after compensation) | mil | 3.0 | ||
| 48 | Min Outer Line width (35um base copper, before compensation) | mil | 5.0 | ||
| 49 | Min Outer Line spacing (35um base copper, after compensation) | mil | 4.0 | ||
| 50 | Min Outer Line width (70um base copper, before compensation) | mil | 6.0 | ||
| 51 | Min Outer Line spacing (70um base copper, after compensation) | mil | 5.0 | ||
| 52 | Spacing from Line to pad, pad to pad (After Compensation) | mil | 3.5(12um), 4.0(18um, 35um), 5.570um), 6.5(150, 140um) | ||
| 53 | Min Outer Line width (105um base copper, before compensation) | mil | 7.0 | ||
| 54 | Min Outer Line spacing (105um base copper, after compensation) | mil | 6.0 | ||
| 55 | Min Outer Line width (140um base copper, before compensation) | mil | 8.0 | ||
| 56 | Min Outer Line spacing (140um base copper, after compensation) | mil | 7.0 | ||
| 57 | Min Grid Line Width | mil | 5 (12, 18, 35um), 10 (70um) | ||
| 58 | Min Grid Spacing | mil | 6 (12, 18, 35um), 8 (70um) | ||
| 59 | Min Hole Pad Diameter | mil | 12 (0.10mm Mechanical or Laser Drill) | ||
| 60 |
Process Capability
|
Max Size for slot tenting | 5mm*3.0mm, the tent land should > 10mil | ||
| 61 | Max diameter for tenting hole | mm | 4.5 | ||
| 62 | Min tent land width | mil | 8 | ||
| 63 | Min annular ring (after compensation, except for blind vias) | mil | 4 (12, 18um) Partial 3.5, 4.5 (35um), 6 (70um), 8 (105um), 10 (140um) | ||
| 64 | Min BGA Diameter | mil | 10 (Flash gold 8 mil) | ||
| 65 |
AOI
|
Machine Capability
|
Orbotech SK-75 AOI | / | 0.05-6.0mm, Max 23.5*23.5 inch |
| 66 | Orbotech Ves Machine | / | 0.05-6.0mm, Max 23.5*23.5 inch | ||
| 67 |
Drilling
|
Machine | MT-GNC2600 Drill machine | an Process 2nd dr | 0.11-6.0mm, max 18.5*26inch Ȼ0.20mm Drill |
| 68 |
Process Capability
|
Min Multi-hit drill bit size | mm | 0.55 | |
| 69 | Max aspect ratio for board thickness VS drill bit size | / | 12:1 (except for ≤0.2mm drill bit, exceed 10:1 needs review) | ||
| 70 | Hole location tolerance (Compare with CAD data) | mil | ±3 | ||
| 71 | Counterbore hole | PTH & NPTH,Top angle 130 Degree, Top Diameter < 6.3mm | |||
| 72 | Min spacing from hole edge to conductive (Except or blind vias) | mil | 6 (≤8L), 7 (≤10L), 8 (≤14L), 12 (≤26L) | ||
| 73 | Max drill bit size | mm | 6.5 | ||
| 74 | Max board thickness for 0.20mm drill bit size | mm | 2.5 | ||
| 75 | Min multi-hit slot width | mm | 0.45 | ||
| 76 | Hole size tolerance for press fit | mil | ±2 | ||
| 77 | Min PTH Slot dimension tolerance | mm | ±0.15 | ||
| 78 | Min NPTH slot dimension tolerance | mm | ±2 (min +0, -0.05 or +0.05, -0) | ||
| 79 | Min spacing from hole edge to conductive (Blind vias) | mil | 9 (1 Cycle pressing), 10 (2 Cycles Pressing), 12 (3 Cycles Pressing) | ||
| 80 | Max board thickness for 0.15mm mechanical drill | mm | 1.20 (≤8L) needs review | ||
| 81 | Min hole size for laser drill | mm | 0.10 (Depth ≤55um), 0.13 (Depth ≤80um), 0.15 (Depth ≤100um) | ||
| 82 | Countersink hole angle & Diameter | Top 82, 90, 120 Degree, Diameter ≤10mm needs review | |||
| 83 |
Wet Process
|
Machine Capability
|
Panel & Pattern plating line | 0.20-7.0mm, max 24*30inch | |
| 84 | Deburring Maching | 0.20-7.0mm, min 8*8inch | |||
| 85 | Desmear Line | Can Process 2nd Desmear | 0.20-7.0mm, max 24*32inch | ||
| 86 |
Process Capability
|
Tin Plating Line | 0.20-3.2mm, max 24*30inch | ||
| 87 | Min hole wall copper thickness | um | Average 25, Min ≥20 | ||
| 88 | Finished copper thickness (12um base copper) | um | ≥18 | ||
| 89 | Finished copper thickness (18um base copper) | um | ≥35 (Nominal thickness 52um, or 1.50Oz) | ||
| 90 | Finished copper thickness (35um base copper) | um | ≥50 (Nominal thickness 65um) | ||
| 91 | Finished copper thickness (70um base copper) | um | ≥85 | ||
| 92 | Min Line width for ectching marking | mil | 8 (12, 18um), 10 (35um), 12 (70um) | ||
| 93 | Max Finished copper thickness for inner and outer layers | / | 1 Oz (250um), ≥4 Oz Needs review | ||
| 94 | Different Copper thinckness | / | 18/35, 35/70 (needs review) | ||
| 95 |
Solder Mask
|
Machine Capability
|
Scrubbing Machine | / | 0.50-7.0mm, Min 9*9inch |
| 96 | Exposer | / | 0.11-7.0mm, max 25*32inch | ||
| 97 | Develop Machine | / | 0.11-7.0mm, min 4*5inch | ||
| 98 |
Colour
|
Solder Mask Colour | / | Green, Yelloe, Black, Blue, Red, White, Matte Green | |
| 99 | Component Mask Colour | / | White, Yellow, Black | ||
| 100 |
Solder Mask Capability
|
Min Solder Mask Opening (Clearance) (After Compensation) | mil | 2 (Partial 1.5 for Flash Gold, other can partia 1) Only for 18um & 35um | |
| 101 | Max Plugged vias size | mm | 0.65mm for drill bit size | ||
| 102 | Min Width for line coverage by S/M | mil | 2 mil per side, only appplies to 18um and 35um base copper | ||
| 103 | Min solder mask legends width | mil | 8 (min 7mil) | ||
| 104 | Min solder mask thickness | um | 10 | ||
| 105 | Solder mas thickness for via tenting | um | 10 | ||
| 106 | Carbon oil line (min) | mil | 10 | ||
| 107 | Carbon oil line space (min) | mil | 14 | ||
| 108 | Tracer of carbon (min) | mil | 2.5 | ||
| 109 | Carbon oil line Trace (min) | mil | 12 | ||
| 110 | Min Spacing from Carbon patterns to pads | mil | 10mil, 70um base copper ≥12mil | ||
| 111 | Min width for peelable mask cover line/ pads | mil | 6 | ||
| 112 | Min solder mask bridge width | mil | Base copper ≤ 1 Oz, Black, white & Matte ink are 6 mils, other inks are 4 mils. Base copper 2-4 Oz , Min bridge width is 6 mils. | ||
| 113 | Solder mask Hardness | H | 6 | ||
| 114 |
Peelable Mask Capability
|
Min Spacing for Peelable mast pattern to pads | mil | 12 | |
| 115 | Max Diameter for peelable mask tent hole (By screen printing) | mm | 2 | ||
| 116 | Max Diameter for peelable mask tent hole (By Aluminum printing) | mm | 4.5 | ||
| 117 | Peelable mask thickness | mm | 0.2-0.5 | ||
| 118 |
Component Mask Capability
|
Min Component Mark Line width & height (12, 18um base copper) | / | Line width 4.5mil; Height 23mil | |
| 119 | Min Component Mark Line width & height (35um base copper) | / | Line width 5mil; Height 27mil | ||
| 120 | Min Component Mark Line width & height (≥70um base copper) | / | Line width 6mil; Height 45mil (State double printing on Lot Card) | ||
| 121 | Min Spacing from legends to pads | mil | 7 | ||
| 122 |
Surface Treatment
|
Surface Treatment Capability
|
Max Gold Finger Length | inch | 2 |
| 123 | Nickel Thickness for ENIG | um | 3-5um | ||
| 124 | Gold Thickness for ENIG | um | 0.025-0.10 | ||
| 125 | Nickel Thickness for Gold Finger | um | 3-May | ||
| 126 | Gold Thickness for Gold Finger | um | 0.25-1.5 | ||
| 127 | Min Tin Thickness for HASL | um | 0.4 (Copper Ground) | ||
| 128 | HASL Machine | Can Process 2nd HASL | 0.6-40mm, min 5*5; max 20*25inch | ||
| 129 | God Finger Surface Treatment | Flash Gold/ ENIG: Flash Gold/ Hard Gold | |||
| 130 | Plating Au | U" | 1-5 (Normal 1u") | ||
| 131 | Plating NI | U" | 120-250 (normal 120u") | ||
| 132 | ENIG & OSP PAD space (min) | mil | 9mil | ||
| 133 | Immersion Gold | 0.2-7.0mm, Min 6*6inch, Max 21*27inch | |||
| 134 | Immersion Tin Thickness | um | 0.8-1.5 | ||
| 135 | Immersion Silver Thickness | um | 0.1-0.3 | ||
| 136 | OSP Thickness | um | 0.2-0.5 | ||
| 137 |
E-Test
|
Machine Capability
|
Flying Probe Tester | 0.4-6.0mm, Max 19.6*23.5inch | |
| 138 | Min Spacing from Test Pad to Board Edge | mm | 0.5 | ||
| 139 | Min Conductive Resistance | Ω | 5 | ||
| 140 | Max Insulation Resistance | MΩ | 250 | ||
| 141 | Max Test Voltage | V | 55 | ||
| 142 | Min Test Pad Diamete | mil | 6 | ||
| 143 | Min Test Pad to Pad Spacing | mil | 10 | ||
| 144 | Max Test Current | mil | 200 | ||
| 145 |
Profiling
|
Machine Capability
|
Profiling Type | / | NC Routing; V-CUT; Slot Tabs; Stamp Hole |
| 146 | NC Routing Machine | Process 2nd round | 0.05-7.0mm, Max 25.5*21inch | ||
| 147 | V-CUT Machine | mm for one side | 0.6-3.0mm, Max board width for v-cut 18inch | ||
| 148 | Min Routing Bit Diameter | mm | 0.6 | ||
| 149 | Outline Tolarance (Line to Line) | mil | ±4 (Complicated utline, slot eeds review) | ||
| 150 | V-CUT Angle Type | 20°, 30°, 45°, 60° | |||
| 151 |
Process Capability
|
V-CUT Angle Tolerance | o | ±5° | |
| 152 | V-CUT Registration Tolerance | mil | ±4 | ||
| 153 | V-CUT Web Thickness Tolerance | mil | ±2 | ||
| 154 | Min Gold Finger Spacing (After Compensation) | mil | 6 | ||
| 155 | Min Spacing to avoid gold finger tab Bevelling | mm | 7 (For Auto-Bevelling) | ||
| 156 | Bevelling Angle Tolerance | / | ±5° | ||
| 157 | Bevelling Remain Thickness Tolerance | mil | ±5 | ||
| 158 | Min Inner Radius | mm | 0.4 | ||
| 159 | Min Spacing from Conductive to Outline | mil | 8 | ||
| 160 | Contersink or Counterbore Depth Tolerance | mm | ±0.10 | ||